Electronic Modules and Methods for Forming the Same

ABSTRACT

Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.

RELATED APPLICATIONS

This application claims the benefit of and priority to U.S. ProvisionalApplication Ser. No. 61/042,512, filed Apr. 4, 2008, the entiredisclosure of which is hereby incorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates, in various embodiments, to theconstruction and fabrication of high density heterogeneous electronicmodules.

BACKGROUND

High density electronic modules have been designed and fabricated tosatisfy the increasing demand for high levels of functionality in smallpackages. Products that may be made from the modules include memory,digital logic, processing devices, and analog and RF circuits.Typically, the integration density of electronic modules is many timesgreater than surface mount technology (“SMT”) is capable of achieving,but less than an application specific integrated circuit (“ASIC”).However, for low volume production, these modules offer an alternativeto ASIC devices, as they require less set-up cost and development time.Moreover, modules may be optimized for particular applications thatdemand multiple functions—for example, a pre-fabricated microelectronicdie optimum for each desired function is selected, and the multiple diesare then interconnected and packaged together to form the module. Often,the pre-fabricated dies will have different form factors andthicknesses, making attempts to package them together in a single moduleproblematic. Additional difficulties may arise when attempting tovertically interconnect different layers of dies together in a singlemodule, as the requisite processing may damage the dies in each layer.

The fabrication of electronic modules typically features pre-thinnedmicroelectronic dies simply positioned on an adhesive-coated substrate.A custom-machined spacer is then placed over and between the dies inorder to provide a planar surface for further processing, includingmetal deposition, patterning, and interconnection. A thin dielectriclayer is often laminated (via application of high pressure) over thedies and spacer to provide the requisite isolation between the dies andthe metal interconnects. Vias to the die pads (i.e., the conductivecontact pads connecting to the inner circuitry of the die) are thenlaser drilled and filled with a conductive material. Although highintegration density may be achieved using this method, there are certainlimitations. For example, dies thinned to less than 100 μm, e.g.,approximately 35 μm or less, might not survive the high pressure usedfor lamination. Furthermore, the dies that are used typically cannot bethinned after they are placed on the module substrate, limiting themodule thicknesses that may be achieved. Another limitation of thismethod is the use of laser-drilled vias, which are typically limited indiameter to approximately 40 μm. This puts constraints on die pad sizes,which restricts design choices to certain devices. In addition, spacingbetween dies must typically be greater than the via diameter to allowdeep via formation. Finally, deep, high-aspect-ratio vias are oftendifficult to reliably and repeatably fill with the conductive material(as is required to interconnect multiple layers in a module).

Thus, in order to service the demand for increasingly smallmicroelectronic systems, improved systems and methods for constructinghigh-density electronic modules are needed.

SUMMARY

In accordance with certain embodiments, a technique is provided forforming high-density electronic modules that include encapsulated diesand reliable interlayer and/or intradie interconnections. The dies arepreferably encapsulated with a bipartite structure that includes adielectric layer protecting the active device surface and an encapsulantsurrounding the rest of the device. Moreover, posts are preferablysimultaneously formed with cavities that contain the die. These postsform at least a portion of electrical connections between dies or acrossa single die.

In one aspect, embodiments of the invention feature a method forconstructing an electronic module. The method includes forming at leastone fill hole in a first side of a substrate and a cavity in a secondside of the substrate. The cavity is in fluidic communication with thefill hole, and a die is positioned within the cavity. An encapsulant isinjected through the fill hole into the cavity to encapsulate the die.The die may be disposed on a dielectric layer that is disposed over thesecond side of the substrate such that the die is within the cavity.

Embodiments of the invention may include one or more of the following.At least one post may be formed within the cavity, and the post may beformed during cavity formation. Forming the post may include positioninga via chip within the cavity, and the via chip may include a matrixdisposed around the post. The matrix may include silicon and the postmay include a metal, e.g., copper. Forming the via chip may includedefining a hole through the thickness of the matrix and forming a metalwithin the hole to form the post.

A conductive material may be formed over the post and the interiorsurface of the cavity. The encapsulated die may be electricallyconnected to a second die, and at least a portion of the electricalconnection may include the post. At least one layer of conductiveinterconnections may be formed over the second side of the substrate. Atleast a portion of the first side of the substrate may be removed toexpose at least a portion of the die, and at least one layer ofconductive interconnects may be formed over the exposed portion of thedie. A handle wafer may be disposed over the second side of thesubstrate prior to removing at least a portion of the first side of thesubstrate. A temporary bonding material may be formed over the handlewafer prior to disposing it over the second side of the substrate. Theencapsulated die may be individuated.

In another aspect, embodiments of the invention feature an electronicmodule that includes a die encapsulated within each of a plurality ofcavities in a substrate. At least one post defines at least a portion ofan electrical connection through the substrate. The post and thesubstrate may include the same material, which may be a semiconductormaterial. The die may be encapsulated by an encapsulant and a dielectriclayer, which may include different materials. The encapsulant mayinclude a filled polymer and the dielectric layer may include anunfilled polymer. Each die may have a surface that is substantiallycoplanar with a surface of each other die. A conductive material may bedisposed over at least the lateral surfaces of the post.

In yet another aspect, embodiments of the invention feature a structurethat includes a substrate defining at least one fill hole and a cavityin fluidic communication with the fill hole. The fill hole is in a firstside of the substrate and the cavity is in a second side of thesubstrate. A die is at least partially encapsulated within the cavity byan encapsulant. A dielectric layer may be disposed over the cavity andin contact with the die. A plurality of fill holes may be in fluidiccommunication with the cavity.

These and other objects, along with advantages and features of theinvention, will become more apparent through reference to the followingdescription, the accompanying drawings, and the claims. Furthermore, itis to be understood that the features of the various embodimentsdescribed herein are not mutually exclusive and can exist in variouscombinations and permutations.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, like reference characters generally refer to the sameparts throughout the different views. Also, the drawings are notnecessarily to scale, emphasis instead generally being placed uponillustrating the principles of the invention. In the followingdescription, various embodiments of the present invention are describedwith reference to the following drawings, in which:

FIGS. 1A-1C are cross-sectional views of an exemplary embodiment of aprocessed substrate utilized to fabricate electronic modules;

FIG. 1D is a perspective view of an exemplary embodiment of a via chipcontaining interconnection posts;

FIG. 1E is a cross-sectional view of an exemplary embodiment of aprocessed substrate including the via chip of FIG. 1D;

FIG. 2 is a cross-sectional view of an exemplary apparatus for themounting and aligning of microelectronic dies;

FIG. 3 is a cross-sectional view of microelectronic dies beingintroduced into the substrate of FIG. 1C in accordance with oneembodiment of the invention;

FIG. 4 is a cross-sectional view of an encapsulation apparatus utilizedto encapsulate microelectronic dies in accordance with embodiments ofthe invention;

FIGS. 5A-5C are cross-sectional views of the formation of contacts toencapsulated microelectronic dies in accordance with one embodiment ofthe invention;

FIGS. 6A and 6B are cross-sectional views of full-thickness substratelayers of an electronic module with multiple layers of interconnects inaccordance with one embodiment of the invention;

FIG. 7A is a cross-sectional view of a full-thickness substrate modulelayer attached to a handle wafer in accordance with one embodiment ofthe invention;

FIG. 7B is a cross-sectional view of the module layer of FIG. 7A after athinning process;

FIGS. 8A-8C are cross-sectional views of the fabrication of back sidecontacts and interconnects on a thinned microelectronic module layer inaccordance with one embodiment of the invention;

FIG. 9A is a cross-sectional view of multiple thinned module layersconnected together in accordance with one embodiment of the invention;and

FIG. 9B is a cross-sectional view of individuated microelectronicmodules fabricated in accordance with embodiments of the invention.

DETAILED DESCRIPTION

Referring to FIG. 1A, a substrate 100 is provided with one or more fillholes 110 formed in its back surface 120. Substrate 100 preferablyincludes or consists essentially of a rigid and/or non-conductivematerial, e.g., glass or a semiconductor such as silicon. In anembodiment, substrate 100 includes or consists essentially of at leastone unmoldable and uncurable material. At least a portion of substrate100 forms the support structure for a high-density electronic modulecontaining multiple microelectronic dies, as further described below. Inan embodiment, substrate 100 is a silicon wafer with a dielectric layerdisposed on at least back surface 120 and a front surface 130. Thedielectric layer may be an oxide, e.g., silicon dioxide, and may have athickness of approximately 1 μm. Fill holes 110 are preferably formed insubstrate 100 by forming a protective layer (not shown), e.g.,photoresist, over front surface 130 and back surface 120, e.g., by aspin-on process. The protective layer on back surface 120 is thenpatterned, e.g., by conventional masked photolithography, such thatareas of back surface 120 where fill holes 110 are to be fabricated aresubstantially free of the protective layer. Fill holes 110 aresubsequently formed by, e.g., plasma or wet etching. In a preferredembodiment, fill holes 110 do not completely penetrate to front surface130 of substrate 100, and have a depth in the range of approximately 200μm to approximately 400 μm. The remaining thickness t₁ between thebottoms of fill holes 110 and front surface 130 may be approximately 150μm. In an embodiment, each fill hole 110 has a diameter of approximately1 mm.

Referring to FIGS. 1B and 1C, at least one cavity 140 is formed in frontsurface 130 of substrate 100. The depth of each cavity 140 may beapproximately 100 μm to approximately 250 μm, and is preferablysufficient to 1) fluidically connect cavity 140 with fill holes 110 and2) substantially contain a microelectronic die 200 (as further describedbelow). Each cavity 140 is preferably in fluidic communication withmultiple fill holes 110 (e.g., between approximately 25 and 36, or evenup to approximately 100), but may also be in fluidic communication withas few as ten, five, or even one fill hole 110. Cavity 140 may be formedby, e.g., conventional masked photolithography and etching. Within eachcavity 140, at least one post 150 may be formed, the height of which issubstantially equal to the depth of cavity 140. Each post 150 may beformed during formation of cavity 140, e.g., simultaneously via the sameetch process. Each post 150 may be roughly cylindrical in shape and havea diameter of approximately 10 μm to approximately 35 μm. In otherembodiments, each post is non-pyramidal, i.e., has approximately thesame diameter throughout its thickness, and/or is in the shape of aprism with a roughly square or rectangular cross-section. In a preferredembodiment, each post 150 remains rigidly connected (at one end) andincludes or consists essentially of the same material as substrate 100and/or a non-metallic material. In a preferred embodiment, each post 150includes or consists essentially of a semiconductor material such assilicon. In another embodiment, each post 150 includes or consistsessentially of a metal such as copper. As illustrated in FIG. 1C, alayer of conductive material 160 may be formed over front side 130 ofsubstrate 100, preferably coating at least all lateral sides of eachpost 150 and the internal surfaces of each cavity 140. Conductivematerial 160 may include or consist essentially of a metal such ascopper, and may have a thickness between approximately 0.5 μm andapproximately 7 μm, or even greater than approximately 7 μm. In anembodiment, the thickness of conductive material 160 is approximately 3μm. In an embodiment, a portion of conductive material 160 (which may bea “seed portion” for electroplating) is formed by physical deposition,e.g., sputtering or evaporation, and a remaining portion is formed byelectroplating. The physically deposited portion of conductive material160 may include or consist essentially of approximately 200 nm of copperover approximately 100 nm of titanium, and the electroplated portion mayinclude or consist essentially of approximately 3 μm of copper. Inanother embodiment, substantially all of conductive material 160 isformed by physical deposition. If desired, conductive material 160 maybe sintered, thus reacting it with the material of post 150 to convertat least a portion of post 150 into a conductive alloy (e.g., a metalsilicide). In a preferred embodiment, even after formation of conductivematerial 160 to metalize posts 150, posts 150 are not entirely formed ofa metal. In various embodiments, conductive material 160 formed withincavities 140 is not removed, at least not until a suitable thinningprocess is performed (as described below).

Referring to FIGS. 1D and 1E, in various embodiments, one or more posts150 are not formed by etching of substrate 100. In such embodiments, oneor more posts 150 may be pre-formed in a via chip 170. Via chip 170 mayinclude or consist essentially of a matrix 180 within which one or moreposts 150 are formed. Matrix 180 may include or consist essentially of adielectric material or a semiconductor material, e.g., silicon. Posts150 preferably extend through the entire thickness of via chip 170. Viachip 170 may be fabricated by forming one or more holes through matrix180, e.g., by etching. The one or more holes may be at leastsubstantially filled (or have their interior surfaces coated) by aconductive material (e.g., a metal) to form post(s) 150. The conductivematerial may be formed by, e.g., electroplating and/or physical vapordeposition. In this manner, one or more posts 150 may be formed in viachip 170 by a process resembling a through-silicon via (TSV) process.Via chip 170 may be introduced into cavity 140 and encapsulated asdescribed below with reference to microelectronic die 200.

FIG. 2 depicts an exemplary apparatus for the mounting and aligning ofmicroelectronic dies to the substrate 100, e.g., within the cavities 140of the substrate 100. As illustrated in FIG. 2, a plurality ofmicroelectronic dies 200 are disposed over a film 210, although, moregenerally, as few as a single microelectronic die 200 may be disposedover the film 210. In an embodiment, one microelectronic die 200 isdisposed over film 210 for each cavity 140 prepared in substrate 100 asdescribed above. Each microelectronic die 200 may include or consistessentially of at least one semiconductor material such as Si, GaAs, orInP, and may be a bare die or a packaged die. In an embodiment, at leastone microelectronic die 200 is a packaged assembly of multiple devices,e.g., a hermetically packaged sensor and/or microelectromechanicalsystems (MEMS) device. In various embodiments, each microelectronic die200 is a microcontroller, a central processing unit, or other type ofchip utilized in various electronic components such as sensors orcomputers. Microelectronic dies 200 may have non-uniform thicknesses,and may differ in size and shape—because the microelectronic dies 200may be encapsulated in cavities 140 as described below, individuallytailored recesses or plinths may not be required for cavities 140 to besuitable to contain a wide range of different microelectronic dies 200.In a preferred embodiment, a dielectric layer 220 is disposed betweenand in contact with each microelectronic die 200 and film 210.Dielectric layer 220 may have a thickness of approximately 10 μm, andmay be formed on film 210 by a spin-on process. In various embodimentsof the invention, dielectric layer 220 includes or consists essentiallyof an unfilled polymer, e.g., a negative-toned spin-on material such asone of the various Intervia Photodielectrics (available from Rohm andHaas Company of Philadelphia, Pa.) or the SINR 3100 series (availablefrom Shin-Etsu MicroSi, Inc. of Phoenix, Ariz.). A first surface of eachmicroelectronic die 200, which typically contains circuitry fabricatedthereon, is in contact with film 210 or dielectric layer 220.

In a preferred embodiment, dielectric layer 220 is a good electricalinsulator, forms uniform coatings over uneven surfaces, and isrelatively transparent. Dielectric layer 220 may be initially formed onfilm 210 as a liquid. In one embodiment, dielectric layer 220 is capableof being used to produce coatings or films with uniform thickness usingequipment typically employed in fabrication of semiconductor devices.Initial heat treatments of dielectric layer 220 may allow it to become“tacky,” or at least mildly adhesive. Further heat treatments mayultimately cure/crosslink dielectric layer 220 such that it becomes arigid structural material.

In one embodiment, dielectric layer 220 is selected for its sensitivityto light (i.e., it is photosensitive or photoimageable). Thus, areas ofdielectric layer 220 may be removed by standard photolithographicmethods, e.g., prior to being fully cured. In another embodiment,dielectric layer 220 is not sensitive to light. In such a case,dielectric layer 220 may be patterned using mechanical methods such asmasking, machining, deep reactive ion etching (DRIE), or ablation with alaser, before or after it is fully cured.

In order to facilitate accurate placement of microelectronic dies 200,film 210 may be placed over die placement mask 230 containing featurescorresponding to the pattern of cavities 140 and posts 150 defined onsubstrate 100. Film 210 and dielectric layer 220 are preferably at leastpartially transparent, and, as such, the microelectronic dies 200 may beplaced on dielectric layer 220 in locations defined on the die placementmask 230 thereunder. Film 210 may include or consist essentially of asubstantially transparent material (e.g., Mylar or Kapton), and it (anddielectric film 220 thereover) may be supported around its perimeter byan alignment ring 240. In an embodiment, alignment ring 240 includes orconsists essentially of a rigid material such as a metal. Die placementmask 230, film 210, and dielectric layer 220 are preferably heated by aheated platen 250 disposed below die placement mask 240 to a temperatureof approximately 60 ° C. to approximately 100° C. The elevatedtemperature softens dielectric layer 220 such that, as eachmicroelectronic die 200 is placed in a desired location (dictated by thepattern on die placement mask 230), it adheres to dielectric layer 220.Once in contact with dielectric layer 220, the front, active surfaces ofmicroelectronic dies 200 may be approximately coplanar, within ±2 μm.The front surfaces of microelectronic dies may be substantially coated,i.e., “sealed,” by dielectric layer 220.

Referring to FIG. 3, microelectronic dies 200 adhered to dielectriclayer 220 may be placed over and aligned to cavities 140 in substrate100. Posts 150 may be utilized as alignment marks, thus facilitatingaccurate alignment of microelectronic dies 200 to cavities 140.Substrate 100 is disposed over a hotplate 300 and within a diaphragm 310. Once microelectronic dies 200 are aligned to cavities 140, alignmentring 240 is lowered such that dielectric layer 220 contacts a surface ofsubstrate 100 and microelectronic dies 200 are substantially disposedwithin cavities 140. A substantial vacuum may be drawn in the spacebetween film 210 and substrate 100 (now “sealed” due to the contactbetween diaphragms 310, 320) such that dielectric film 220 preferably(and substantially uniformly) contacts a top surface of substrate 100and posts 150. Thus, dielectric film 220 “seals” microelectronic dies200 within cavities 140, as shown in FIG. 4. In an embodiment,microelectronic dies 200 adhere to dielectric film 220 within cavities140, but not to an internal surface of cavities 140.

Referring to FIG. 4, an encapsulation chamber 400 may be utilized toencapsulate the microelectronic dies 200 within cavities 140. Substrate100, now adhered to dielectric film 220 (which itself is disposed onfilm 210 and alignment ring 240) is placed within encapsulation chamber400. Additionally disposed within encapsulation chamber 400, on opposingsides of substrate 100, are platen 410 and pressure plate 420. At leastone o-ring 430 is disposed over platen 410, and film 440 is disposedover platen 410 and o-rings 430, thus forming pockets 445. Each pocket445 may contain encapsulant 450. Platen 410 preferably includes orconsists essentially of a rigid material, e.g., a metal, and isheatable. O-rings 430 may include or consist essentially of anelastomeric material such as silicone, and film 440 may include orconsist essentially of Teflon. Platen 410 also includes holes 460suitable for the conduction of compressed gas (e.g., compressed air), asdescribed further below. The introduction of compressed gas throughholes 460 applies pressure to the back surface of film 440 in pockets445, and film 440 may deflect in response to the applied pressure.Encapsulation chamber 400 also includes vacuum port 470 connected to avacuum pump (not shown) that enables the evacuation of encapsulationchamber 400.

In an exemplary embodiment, microelectronic dies 200 are encapsulatedaccording to the following steps. First, platen 410 is heated toapproximately 30° C. and encapsulation chamber 400 is evacuated forapproximately 5 minutes in order to out-gas encapsulant 450. The vacuumin encapsulation chamber 400 also substantially prevents the formationof trapped air bubbles in cavities 140 during encapsulation ofmicroelectronic dies 200 (as described below). Fill holes 110 arealigned above pockets 445, and force is applied to pressure plate 420 inorder to seal the back surface of substrate 100 to o-rings 430 coveredwith film 440. A pressure of approximately 15 pounds per square inch(psi) is applied to the back surface of film 440 via the introduction ofcompressed gas through holes 460, thus forcing encapsulant 450 throughfill holes 110 into cavities 140. Dielectric film 220, supported bypressure plate 420, at least substantially prevents the flow ofencapsulant 450 between microelectronic dies 200 and dielectric film220, maintaining the substantial coplanarity of the top surfaces ofmicroelectronic dies 200. The pressure is applied for approximately 5minutes, whereupon the pressure is reduced to, e.g., approximately 1psi. Platen 410 is heated to approximately 60° C. for a time periodsufficient to at least substantially cure encapsulant 450, e.g.,approximately 4 hours. As encapsulant 450 cures, its volume may bereduced, and the pressure applied to film 440 is sufficient to injectadditional encapsulant 450 into cavities 140. Thus, cavities 140 arecontinuously filled with encapsulant 450 during curing, ensuring thatcavities 140 are substantially or completely filled with encapsulant 450after curing. Substrate 100 is then removed from encapsulation chamber400, and excess encapsulant 450 present on the back surface of substrate100 may be removed by, e.g., scraping with a razor blade and/orapplication of a suitable solvent. Curing may be continued at atemperature of approximately 60° C. for a period of approximately 3hours to approximately 5 hours. Film 210 is then removed from substrate100, leaving dielectric layer 220 substantially or completely intact.After removal of film 210, the exposed surface of dielectric layer 220is preferably planar to within ±2 μm. The presence of dielectric layer220 over microelectronic dies 200 preferably maintains this planarityeven after introduction of encapsulant 450, obviating the need toseparately planarize encapsulant 450 and/or microelectronic dies 200after encapsulation. In other embodiments, other techniques are utilizedto introduce encapsulant 450 into cavities 140. For example, a syringe,an injection-molding screw, or a piston pump may be utilized tointroduce encapsulant 450 into cavities 140 through fill holes 110.

In an exemplary embodiment, encapsulant 450 includes or consistsessentially of a filled polymer such as molding epoxy. The filler mayreduce the thermal expansion of the polymer, and may include or consistessentially of minerals, e.g., quartz, in the form of particles, e.g.,spheres, having characteristic dimensions, e.g., diameters, smaller thanapproximately 50 μm. Encapsulant 450 may be an insulating materialhaving a coefficient of thermal expansion (CTE) approximately equal tothe CTE of silicon. Encapsulant 450 may be present in pockets 445 in theform of a paste or thick fluid, or in the form of a powder that meltsupon application of pressure thereto. Subsequent processing maycure/crosslink encapsulant 450 such that it becomes substantially rigid.In various embodiments, encapsulant 450 includes or consists essentiallyof a heavily filled material such as Shin-Etsu Semicoat 505 or SMC-810.

As described above, encapsulant 450 and dielectric layer 220 maycooperatively encapsulate microelectronic dies 200. Encapsulation bymultiple materials may be preferred, as encapsulant 450 (which is moldedaround the majority of each microelectronic die 200) and dielectriclayer 220 (which coats the surface of each microelectronic die 200containing active circuitry) may advantageously have different materialproperties and/or methods of processing. Encapsulant 450 may wet to andbond directly to dielectric layer 220, thereby forming a substantiallyseamless interface.

Referring to FIGS. 5A-5C, conductive connections to metalized posts 150and to contact pads on the surface of microelectronic dies 200, as wellas a first metallization layer, may be formed according to the followingexemplary steps. First, dielectric layer 220, which is preferablyphotosensitive, is patterned by, e.g., conventional maskedphotolithography, to form via holes 500. Prior to patterning, dielectriclayer may have been soft baked at approximately 90° C. for approximately60 seconds. Via holes 500 may have a diameter between approximately 5 μmand approximately 20 μm. Patterned dielectric layer 220 is thensubjected to a hard bake of approximately 190° C. for approximately 1hour, after which it is substantially planar to within ±2 μm. Asillustrated in FIG. 5B, conductive material 510 is subsequently formedover dielectric layer 220, coating and substantially or completelyfilling via holes 500 (thus forming conductive vias therein). Conductivematerial 510 may include or consist essentially of a metal such ascopper, and may have a thickness between approximately 0.5 μm andapproximately 7 μm, or even greater than approximately 7 μm. In anembodiment, a portion of conductive material 510 (which may be a “seedportion” for electroplating) is formed by physical deposition, e.g.,sputtering or evaporation, and a remaining portion is formed byelectroplating. In various embodiments, the electroplated portion may beomitted, i.e., substantially all of conductive material 510 is formed byphysical deposition. The physically deposited portion of conductivematerial 510 may include or consist essentially of approximately 200 nmto approximately 2000 nm of copper over approximately 100 nm oftitanium, and the electroplated portion may include or consistessentially of approximately 3 μm to approximately 7 μm of copper.Conductive material 510 may also include a capping layer ofapproximately 100 nm of titanium that may be formed by, e.g., a physicaldeposition method such as sputtering. The filling of via holes 500 withconductive material 510 is facilitated by the fact that via holes 500only extend through the thickness of dielectric layer 220, whereupon atleast some via holes 500 reach metalized posts 150. This arrangementobviates the need for the filling of high-aspect-ratio vias for thesubsequent formation of interconnections on or near the back side ofmicroelectronic dies 200 (after substrate thinning as described below),which may be difficult in many circumstances. As illustrated in FIG. 5C,conductive material 510 is patterned by, e.g., conventional maskedphotolithography and etching (e.g., wet or plasma etching) to forminterconnection layer 520. In a preferred embodiment, conductivematerial 510 is etched by application of a commercially available metaletchant such as ferric chloride or chromic acid. After etching,interconnection layer 520 preferably includes conductive lines with aminimum linewidth of less than approximately 12.5 μm, or even less thanapproximately 5 μm.

Referring to FIG. 6A, after formation of interconnection layer 520,another dielectric film (which may be substantially identical todielectric layer 220) may be deposited thereover, and the stepsdescribed above with reference to FIGS. 5A-5C may be repeated once oreven multiple times. The resulting pre-thinned module layer 600 includesa desired number and arrangement of metal interconnection layers.Referring to FIG. 6B, a solder mask 610 may be formed over pre-thinnedmodule layer 600 and patterned by, e.g., conventional maskedphotolithography. Solder mask 610 may include or consist essentially ofa photosensitive dielectric material, e.g., those described above withreference to dielectric layer 220. Openings 620 in solder mask may belater utilized to form, e.g., solder ball connections to topmostinterconnection layer 630.

Referring to FIGS. 7A and 7B, in various embodiments of the invention, ahandle wafer 700 is wafer bonded to pre-thinned module layer 600according to the following steps. A temporary bonding material 710 isformed over pre-thinned module layer 600 by, e.g. a spin-on orsilk-screen process. Temporary bonding material 710 may include orconsist essentially of, e.g., WaferBOND or WaferBOND HT-250 (bothavailable from Brewer Science, Inc. of Rolla, Mo.). In an embodiment,temporary bonding material 710 is applied to handle wafer 700 byspinning it on at a rate of approximately 1000 to approximately 3500rpm. Temporary bonding material 710 may then be baked at a temperatureof approximately 170° C. to approximately 220° C. for a time ofapproximately 7 minutes. Handle wafer 700 may then be brought intocontact with pre-thinned module layer 600 utilizing, e.g., an EVG 501wafer bonding tool (available from EV Group E. Thallner GmbH ofAustria). The wafer bonding process may include applying a pressure ofapproximately 15 psi to handle wafer 700 and pre-thinned module layer600, as well as applying an elevated temperature (between approximately140° C. and approximately 220° C.) thereto. Handle wafer 700 may includeor consist essentially of glass, or may be a semiconductor (e.g.,silicon) wafer having a dielectric layer (e.g., an oxide such as silicondioxide) formed thereover.

After handle wafer 700 is bonded to a first surface of pre-thinnedmodule layer 600, a thinning process may be performed, as illustrated inFIG. 7B, on a second, opposing side of pre-thinned module layer 600.During thinning, a thickness t₂ (illustrated in FIG. 7A) of pre-thinnedmodule layer 600 is preferably removed, thus exposing (or even removing)at least a portion of a bottom surface of encapsulated microelectronicdies 200 and at least a portion of metalized posts 150. Microelectronicdies 200 and posts 150 remain in their desired locations, as they areencapsulated in encapsulant 450. The thinning process may include orconsist essentially of mechanical grinding or lapping, e.g., on a copperlapping plate, with a polishing slurry, e.g., diamond particlessuspended in a liquid such as water. In an embodiment, an exposedsurface of thinned module layer 720 thus formed is further smoothed by,e.g., chemical-mechanical polishing. After removal of thickness t₂ ofpre-thinned module layer 600, each post 150 preferably forms at least asubstantial portion of an electrical connection through substrate 100.As further described below, this connection may be utilized as anintradie interconnect (e.g., connecting the front and back sides ofmicroelectronic die 200) and/or as an interconnect to further layers ofmicroelectronic dies in an electronic module.

Referring to FIGS. 8A-8C, conductive backside connections to metalizedposts 150, as well as a first backside metallization layer, may beformed according to the following exemplary steps. First, dielectriclayer 800, which is preferably photosensitive (and may include orconsist essentially of materials described above for dielectric layer220), is patterned by, e.g., conventional masked photolithography, toform backside via holes 810. Each backside via hole 810 may have adiameter of approximately 20 μm. As illustrated in FIG. 8B, conductivematerial 820 is subsequently formed over dielectric layer 800,substantially or completely filling backside via holes 810 (thus formingconductive vias therein). Conductive material 820 may include or consistessentially of a metal such as copper, and may have a thickness betweenapproximately 0.5 μm and approximately 7 μm, or even greater thanapproximately 7 μm. In an embodiment, a portion of conductive material820 (which may be a “seed portion” for electroplating) is formed byphysical deposition, e.g., sputtering or evaporation, and a remainingportion is formed by electroplating. In various embodiments, theelectroplated portion may be omitted, i.e., substantially all ofconductive material 820 is formed by physical deposition. The physicallydeposited portion of conductive material 820 may include or consistessentially of approximately 200 nm to approximately 2000 nm of copperover approximately 100 nm of titanium, and the electroplated portion mayinclude or consist essentially of approximately 3 μm to approximately 7μm of copper. Conductive material 820 may also include a capping layerof approximately 100 nm of titanium that may be formed by, e.g., aphysical deposition method such as sputtering. As described above withrespect to via holes 500, connections through backside via holes 810 arefacilitated by the presence of metalized posts 150, which obviate theneed for high-aspect-ratio via filling. As illustrated in FIG. 8C,conductive material 820 is patterned by, e.g., conventional maskedphotolithography and etching (e.g., wet or plasma etching) to formbackside interconnection layer 830. In a preferred embodiment,conductive material 820 is etched by application of a commerciallyavailable metal etchant such as ferric chloride or chromic acid. Afteretching, backside interconnection layer 830 preferably includesconductive lines with a minimum linewidth of less than approximately12.5 μm, or even less than approximately 5 μm.

Thinned module layer 720 with backside interconnection layer 830 mayoptionally be connected to a second, similarly processed, thinned modulelayer 850 by, e.g., bonding the backside interconnection layers of eachmodule 720, 850 together, as shown in FIG. 9A. The handle wafer of thesecond module layer 850 (not shown) may be removed, and another (ormultiple) module layer(s) may be connected to the exposed surface of thesecond module layer 850. In a preferred embodiment, each additionalmodule layer includes at least one microelectronic die that isencapsulated prior to attachment to thinned module layer 720. Asillustrated in FIG. 9B, after a desired number (which may be none) ofadditional module layers is connected to thinned module layer 720,modules 900 may be individuated from the stacked module layers by, e.g.,die sawing. Posts 150 may interconnect front and back surfaces ofmicroelectronic dies 200 or may form interdie interconnections withineach module 900. Handle wafer 700 may be removed either before or afterindividuation of modules 900. Removal of handle wafer 700 may beaccomplished by heating to a suitable debonding temperature (which maybe approximately 130° C. to approximately 250° C., depending on theselected temporary bonding material 710), and sliding away handle wafer700. Modules 900 may then be suitably cleaned and utilized in any of avariety of applications, including ultra-miniature sensors, spaceapplications with mass and size restrictions, fully integratedMEMS-complementary metal-oxide-semiconductor (MEMS-CMOS) structures, andimplantable biological sensors. Microelectronic dies 200 within modules900 may include analog or digital integrated circuits, digital signalprocessors, wireless communication components such as radio frequencyreceivers and transmitters, optical signal processors, optical routingcomponents such as waveguides, biological and chemical sensors,transducers, actuators, energy sources, MEMS devices, and/or passivecomponents such as resistors, capacitors, and inductors.

The terms and expressions employed herein are used as terms andexpressions of description and not of limitation, and there is nointention, in the use of such terms and expressions, of excluding anyequivalents of the features shown and described or portions thereof. Inaddition, having described certain embodiments of the invention, it willbe apparent to those of ordinary skill in the art that other embodimentsincorporating the concepts disclosed herein may be used withoutdeparting from the spirit and scope of the invention. Accordingly, thedescribed embodiments are to be considered in all respects as onlyillustrative and not restrictive.

1. A method for constructing an electronic module, the methodcomprising: forming a fill hole in a first side of a substrate and acavity in a second side of the substrate, the cavity in fluidiccommunication with the fill hole; positioning a die within the cavity;and injecting an encapsulant through the fill hole into the cavity toencapsulate the die positioned therein.
 2. The method of claim 1,wherein positioning the die within the cavity comprises: disposing thedie on a dielectric layer; and disposing the dielectric layer over thesecond side of the substrate such that the die is disposed within thecavity.
 3. The method of claim 1, further comprising forming a postwithin the cavity.
 4. The method of claim 3, further comprising forminga conductive material over the post and an interior surface of thecavity.
 5. The method of claim 4, further comprising electricallyconnecting a second die to the encapsulated die.
 6. The method of claim5, wherein at least a portion of the electrical connection comprises thepost.
 7. The method of claim 3, wherein the post is formed duringformation of the cavity.
 8. The method of claim 3, wherein forming thepost comprises positioning a via chip within the cavity, the via chipcomprising a matrix disposed around the post.
 9. The method of claim 8,wherein the matrix comprises silicon and the post comprises a metal. 10.The method of claim 8, further comprising forming the via chip bydefining a hole through a thickness of the matrix and forming a metalwithin the hole to form the post.
 11. The method of claim 1, furthercomprising forming at least one layer of conductive interconnects overthe second side of the substrate.
 12. The method of claim 1, furthercomprising removing at least a portion of the first side of thesubstrate to expose at least a portion of the die.
 13. The method ofclaim 12, further comprising forming at least one layer of conductiveinterconnects over the exposed portion of the die.
 14. The method ofclaim 12, further comprising, prior to the removing, disposing a handlewafer over the second side of the substrate.
 15. The method of claim 14,further comprising forming a layer of temporary bonding material overthe handle wafer prior to disposing the handle wafer over the secondside of the substrate.
 16. The method of claim 1, further comprisingindividuating at least the encapsulated die.
 17. An electronic modulecomprising: a substrate comprising a plurality of cavities, a dieencapsulated within each cavity; and a post defining at least a portionof an electrical connection through the substrate.
 18. The electronicmodule of claim 17, wherein the post and the substrate each comprise thesame material.
 19. The electronic module of claim 17, wherein the postand the substrate each comprise a semiconductor material.
 20. Theelectronic module of claim 17, wherein the die is encapsulated by anencapsulant and a dielectric layer.
 21. The electronic module of claim20, wherein the encapsulant and the dielectric layer comprise differentmaterials.
 22. The electronic module of claim 21, wherein theencapsulant comprises a filled polymer and the dielectric layercomprises an unfilled polymer.
 23. The electronic module of claim 17,wherein each die has a surface that is substantially coplanar with asurface of each other die.
 24. The electronic module of claim 17,wherein a conductive material is disposed over at least the lateralsurfaces of the post.
 25. A structure comprising: a substrate definingat least one fill hole in a first side thereof and a cavity in a secondside thereof, the cavity in fluidic communication with the at least onefill hole; and a die at least partially encapsulated within the cavityby an encapsulant.
 26. The structure of claim 25, further comprising adielectric layer disposed over the cavity and in contact with the die.27. The structure of claim 25, wherein a plurality of fill holes are influidic communication with the cavity.